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Antenna-in-package system integrated with meander line antenna based on LTCCtechnology

Gang DONG,Wei XIONG,Zhao-yao WU,Yin-tang YANG

Frontiers of Information Technology & Electronic Engineering 2016, Volume 17, Issue 1,   Pages 67-73

Abstract: The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chipmodule (MCM) for integration of integrated circuit (IC) bare chips.A microstrip feed line is used to

Keywords： Antenna-in-package (AiP)     Meander line antenna     Multi-chip module (MCM)     Low temperature co-fired ceramic    

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Antenna-in-package system integrated with meander line antenna based on LTCC technology

Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang,gdong@mail.xidian.edu.cn

Frontiers of Information Technology & Electronic Engineering 2016, Volume 17, Issue 1,   Pages 67-73 doi: 10.1631/FITEE.1500167

Abstract: We present an antenna-in-package system integrated with a based on technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a was fabricated and the experimental results agreed with simulations well.

Keywords： Antenna-in-package (AiP)     Meander line antenna     Multi-chip module (MCM)     Low temperature co-fired ceramic    

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Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Frontiers of Mechanical Engineering 2013, Volume 8, Issue 2,   Pages 118-126 doi: 10.1007/s11465-013-0253-y

Abstract:

To enhance the performance of high speed transfer system of LED chip sorting equipment, its controlwhich the multiple control parameters optimization, modeling and simulation were included, i.e., a multi-domain

Keywords： LED chip sorter     multi-domain modeling and simulation     parameter optimization     modelica language    

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Back-End Electronics Manufacturing Equipment in China and Their Key Components

Chen Xin , Chen Yun , Chen Xun , Wu Xiaojie

Strategic Study of CAE 2022, Volume 24, Issue 4,   Pages 74-84 doi: 10.15302/J-SSCAE-2022.04.008

Abstract: Chip manufacturing, which includes chip design, wafer production, and high-precision lithography, occursThe US Chip Act, passed in 2021, encourages enterprises and government departments to investequipment, the industry’s dependence on external resources, particularly in the subfields of chipthe next two years, the company will expand production by establishing 150 to 200 large-scale display moduleenterprise (1 billion CNY level); specialized, innovative, and new enterprises in the field of panel module

Keywords： back-end electronics manufacturing     supply chain reshaping     electronics manufacturing equipment     multi-chip    

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Enhanced CuCl dispersion by regulating acidity of MCM-41 for catalytic oxycarbonylation of ethanol to

Pengzhen CHEN, Shouying HUANG, Jijie ZHANG, Shengping WANG, Xinbin MA

Frontiers of Chemical Science and Engineering 2015, Volume 9, Issue 2,   Pages 224-231 doi: 10.1007/s11705-014-1447-5

Abstract: Mesoporous MCM-41 has been widely used as catalyst support due to its large surface area and well definedConsidering its intrinsic weak acidity, MCM-41 was modified by a simple impregnation method to incorporatedispersion of Cu species and the increase of acid sites without changing the mesoporous structure of MCM-41, and thus enhanceed the catalytic activity of CuCl/MCM-41for diethyl carbonate synthesis.

Keywords： MCM-41     acidity     oxidative carbonylation     diethyl carbonate    

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Synthesis, characterization and catalytic properties of mesoporous MCM-48 containing zeolite secondary

LI Qiang, ZHANG Ying, DOU Tao, LI Yuping, WANG Shan, SUN Famin

Frontiers of Chemical Science and Engineering 2007, Volume 1, Issue 1,   Pages 1-5 doi: 10.1007/s11705-007-0001-0

Abstract: Mesoporous aluminosilicate MCM-48 containing zeolite secondary building units in the pore wall has beenX-ray Diffraction (XRD) patterns of the as-made samples indicated that highly ordered mesostructured MCMCompared with the conventionally synthesized MCM-48, the as-synthesized MCM-48 sample showed an adsorptionFinally, the catalytic performance of the as-made MCM-48 was evaluated by hydrogenation dealkylationMCM-48 catalyst.

Keywords： diameter     mesostructured MCM-48     Catalytic     presence     five-membered    

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Ti incorporation in MCM-41 mesoporous molecular sieves using hydrothermal synthesis

Shengping WANG, Changqing MA, Yun SHI, Xinbin MA

Frontiers of Chemical Science and Engineering 2014, Volume 8, Issue 1,   Pages 95-103 doi: 10.1007/s11705-014-1405-2

Abstract: Titanium-containing mesoporous materials (Ti-MCM-41) were obtained by hydrothermal synthesis.To understand the role of the Ti in the catalytic process, Ti-MCM-41 samples with different Si/Ti ratiosIt was concluded that the Ti is incorporated into the framework of the MCM-41 and formed weak Lewis aciddiffraction, N adsorption-desorption and transmission electron microscopy results showed that the Ti-MCMstructure and large pore diameters are favorable for the transesterification catalytic properties of Ti-MCM

Keywords： Ti-MCM-41     mesoporous molecular sieve     acid sites     transesterification     hydrothermal synthesis    

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Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Frontiers of Mechanical Engineering 2012, Volume 7, Issue 1,   Pages 29-37 doi: 10.1007/s11465-012-0314-7

Abstract: Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chipvibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chipThe flip chip analytical model is revised by considering the influence of spring mass on mechanical energyThis revised model is then applied to estimate the flip chip resonance frequencies.Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection

Keywords： flip chip     defect detection     ultrasonic excitation     vibration analysis    

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Synthesis of nanofluids composed of deep eutectic solvents and metal-modified MCM-41 particles as multifunctional

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 11,   Pages 1776-1787 doi: 10.1007/s11705-023-2314-z

Abstract: To overcome these limitations, four nanofluids were prepared by dispersing different metal-modified MCMIn addition, NF@Cu/Al-MCM-41-2.5% exhibited the best desulfurization performance among the prepared nanofluidsand defect sites to improve the catalytic activity and adsorbability, and the best affinity of Cu/Al-MCM

Keywords： fuel oil desulfurization     nanofluids     catalytic ozonation    

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Variable identification and automatic tuning of the main module of a servo system of parallel mechanism

YANG Zhiyong, XU Meng, HUANG Tian, NI Yanbing

Frontiers of Mechanical Engineering 2007, Volume 2, Issue 1,   Pages 82-88 doi: 10.1007/s11465-007-0014-x

Abstract: The variables of the main module of a servo system for miniature reconfigurable parallel mechanism wereWith the reverse solution module of the translation, the module with the exerted translation joint was

Keywords： acceleration     reconfigurable parallel     additive     sequence     parallel mechanism    

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Atomistic simulations for adsorption and separation of flue gas in MFI zeolite and MFI/MCM-41 micro/mesoporous

Shengchi ZHUO, Yongmin HUANG, Jun HU, Honglai LIU

Frontiers of Chemical Science and Engineering 2011, Volume 5, Issue 2,   Pages 264-273 doi: 10.1007/s11705-010-1007-6

Abstract: Fully atomistic models of MFI and MFI/MCM-41 are constructed and characterized.CO isotherm in MFI/MCM-41 is similar to that in MFI at low pressures, but resembles that in MCM-41 atN shows similar amount of loading in MFI, MCM-41 and MFI/MCM-41.The selectivity of CO over N in the three adsorbents decreases in the order of MFI>MFI/MCM-41>MCM-41With increasing pressure, the selectivity increases in MFI and MFI/MCM-41, but decreases in MCM-41.

Keywords： adsorption     diffusion     CO2     flue gas     zeolite     micro/mesoporous composite    

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Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 581-590 doi: 10.1007/s11465-017-0454-x

Abstract:

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set

Keywords： electric field microsensor     three-dimensional     single-chip     in-plane rotation    

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Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 4,   Pages 472-472 doi: 10.1007/s11465-009-0077-y

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Multi-objective layout optimization of a satellite module using the Wang-Landau sampling method with Article

Jing-fa LIU,Liang HAO,Gang LI,Yu XUE,Zhao-xia LIU,Juan HUANG

Frontiers of Information Technology & Electronic Engineering 2016, Volume 17, Issue 6,   Pages 527-542 doi: 10.1631/FITEE.1500292

Abstract: It is not only a complex coupled system design problem but also a special multi-objective optimizationIn this paper we use the WL sampling method to optimize the layout of a satellite module.

Keywords： Packing     Layout design     Satellite module     Wang-Landau algorithm    

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SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Frontiers of Agricultural Science and Engineering 2023, Volume 10, Issue 3,   Pages 448-457 doi: 10.15302/J-FASE-2023490

Abstract:

● Low-value biowaste including wood chip and potato peel was valorized

Keywords： Aspen Plus     co-gasification     potato peel     syngas     simulation     waste reduction     wood chip    

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Title Author Date Type Operation

Antenna-in-package system integrated with meander line antenna based on LTCCtechnology

Gang DONG,Wei XIONG,Zhao-yao WU,Yin-tang YANG

Journal Article

Antenna-in-package system integrated with meander line antenna based on LTCC technology

Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang,gdong@mail.xidian.edu.cn

Journal Article

Dymola-based multi-parameters integrated optimization for high speed transfer system of LED chip sorter

Jie OUYANG, Bin LI, Shihua GONG

Journal Article

Back-End Electronics Manufacturing Equipment in China and Their Key Components

Chen Xin , Chen Yun , Chen Xun , Wu Xiaojie

Journal Article

Enhanced CuCl dispersion by regulating acidity of MCM-41 for catalytic oxycarbonylation of ethanol to

Pengzhen CHEN, Shouying HUANG, Jijie ZHANG, Shengping WANG, Xinbin MA

Journal Article

Synthesis, characterization and catalytic properties of mesoporous MCM-48 containing zeolite secondary

LI Qiang, ZHANG Ying, DOU Tao, LI Yuping, WANG Shan, SUN Famin

Journal Article

Ti incorporation in MCM-41 mesoporous molecular sieves using hydrothermal synthesis

Shengping WANG, Changqing MA, Yun SHI, Xinbin MA

Journal Article

Detection of solder bump defects on a flip chip using vibration analysis

Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO

Journal Article

Synthesis of nanofluids composed of deep eutectic solvents and metal-modified MCM-41 particles as multifunctional

Journal Article

Variable identification and automatic tuning of the main module of a servo system of parallel mechanism

YANG Zhiyong, XU Meng, HUANG Tian, NI Yanbing

Journal Article

Atomistic simulations for adsorption and separation of flue gas in MFI zeolite and MFI/MCM-41 micro/mesoporous

Shengchi ZHUO, Yongmin HUANG, Jun HU, Honglai LIU

Journal Article

Single-chip 3D electric field microsensor

Biyun LING, Yu WANG, Chunrong PENG, Bing LI, Zhaozhi CHU, Bin LI, Shanhong XIA

Journal Article

Development of an electrorheological chip and conducting polymer based sensor

Xianzhou ZHANG, Weihua LI, Weijia WEN, Yanzhe WU, Gordon WALLACE,

Journal Article

Multi-objective layout optimization of a satellite module using the Wang-Landau sampling method with

Jing-fa LIU,Liang HAO,Gang LI,Yu XUE,Zhao-xia LIU,Juan HUANG

Journal Article

SIMULATION OF O-BLOWN CO-GASIFICATION OF WOOD CHIP AND POTATO PEEL FOR PRODUCING SYNGAS

Journal Article